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Quad Flat No-lead Package

Applications：

 Power Management, High Thermal Conductive Devices 

 RF,Switch Devices

 Logic,Analog, and Sensors,

 Industry Micro-Controller

Features:

 Customized package size and leads in limited body size (1~10mm )

 Au, Cu, Ag-alloy, Al bonding process capabilities

 Multi-chip capability for stack or flat lie

 Component surface mount capability

 SiP assembly capability

 PPF or pure tin surface finish is optional

Reliability Condition:

 Moisture Sensitivity Pre-condition :
   -MSL3: 192hrs@30℃/60% RH
   -MSL1: 168hrs@85℃/85% RH

 Temperature Cycle: 500 cycles @ -65℃ /+150℃

 Highly Accelerated Temp and Humidity Stress Test: 96hrs @130oC/85% RH

 High Temperature Storage: 1000hrs@150℃

Package Outlines   Dimensions:

Standard

L/F Thickness

(mm)

Mold Cap

Thickness

(mm)

Standard

Pkg Thickness

(mm)

Min Lead Pitch

(mm)